1Generic Thermal Sysfs driver How To 2=================================== 3 4Written by Sujith Thomas <sujith.thomas@intel.com>, Zhang Rui <rui.zhang@intel.com> 5 6Updated: 2 January 2008 7 8Copyright (c) 2008 Intel Corporation 9 10 110. Introduction 12 13The generic thermal sysfs provides a set of interfaces for thermal zone 14devices (sensors) and thermal cooling devices (fan, processor...) to register 15with the thermal management solution and to be a part of it. 16 17This how-to focuses on enabling new thermal zone and cooling devices to 18participate in thermal management. 19This solution is platform independent and any type of thermal zone devices 20and cooling devices should be able to make use of the infrastructure. 21 22The main task of the thermal sysfs driver is to expose thermal zone attributes 23as well as cooling device attributes to the user space. 24An intelligent thermal management application can make decisions based on 25inputs from thermal zone attributes (the current temperature and trip point 26temperature) and throttle appropriate devices. 27 28[0-*] denotes any positive number starting from 0 29[1-*] denotes any positive number starting from 1 30 311. thermal sysfs driver interface functions 32 331.1 thermal zone device interface 341.1.1 struct thermal_zone_device *thermal_zone_device_register(char *name, 35 int trips, int mask, void *devdata, 36 struct thermal_zone_device_ops *ops) 37 38 This interface function adds a new thermal zone device (sensor) to 39 /sys/class/thermal folder as thermal_zone[0-*]. It tries to bind all the 40 thermal cooling devices registered at the same time. 41 42 name: the thermal zone name. 43 trips: the total number of trip points this thermal zone supports. 44 mask: Bit string: If 'n'th bit is set, then trip point 'n' is writeable. 45 devdata: device private data 46 ops: thermal zone device call-backs. 47 .bind: bind the thermal zone device with a thermal cooling device. 48 .unbind: unbind the thermal zone device with a thermal cooling device. 49 .get_temp: get the current temperature of the thermal zone. 50 .get_mode: get the current mode (enabled/disabled) of the thermal zone. 51 - "enabled" means the kernel thermal management is enabled. 52 - "disabled" will prevent kernel thermal driver action upon trip points 53 so that user applications can take charge of thermal management. 54 .set_mode: set the mode (enabled/disabled) of the thermal zone. 55 .get_trip_type: get the type of certain trip point. 56 .get_trip_temp: get the temperature above which the certain trip point 57 will be fired. 58 591.1.2 void thermal_zone_device_unregister(struct thermal_zone_device *tz) 60 61 This interface function removes the thermal zone device. 62 It deletes the corresponding entry form /sys/class/thermal folder and 63 unbind all the thermal cooling devices it uses. 64 651.2 thermal cooling device interface 661.2.1 struct thermal_cooling_device *thermal_cooling_device_register(char *name, 67 void *devdata, struct thermal_cooling_device_ops *) 68 69 This interface function adds a new thermal cooling device (fan/processor/...) 70 to /sys/class/thermal/ folder as cooling_device[0-*]. It tries to bind itself 71 to all the thermal zone devices register at the same time. 72 name: the cooling device name. 73 devdata: device private data. 74 ops: thermal cooling devices call-backs. 75 .get_max_state: get the Maximum throttle state of the cooling device. 76 .get_cur_state: get the Current throttle state of the cooling device. 77 .set_cur_state: set the Current throttle state of the cooling device. 78 791.2.2 void thermal_cooling_device_unregister(struct thermal_cooling_device *cdev) 80 81 This interface function remove the thermal cooling device. 82 It deletes the corresponding entry form /sys/class/thermal folder and 83 unbind itself from all the thermal zone devices using it. 84 851.3 interface for binding a thermal zone device with a thermal cooling device 861.3.1 int thermal_zone_bind_cooling_device(struct thermal_zone_device *tz, 87 int trip, struct thermal_cooling_device *cdev, 88 unsigned long upper, unsigned long lower); 89 90 This interface function bind a thermal cooling device to the certain trip 91 point of a thermal zone device. 92 This function is usually called in the thermal zone device .bind callback. 93 tz: the thermal zone device 94 cdev: thermal cooling device 95 trip: indicates which trip point the cooling devices is associated with 96 in this thermal zone. 97 upper:the Maximum cooling state for this trip point. 98 THERMAL_NO_LIMIT means no upper limit, 99 and the cooling device can be in max_state. 100 lower:the Minimum cooling state can be used for this trip point. 101 THERMAL_NO_LIMIT means no lower limit, 102 and the cooling device can be in cooling state 0. 103 1041.3.2 int thermal_zone_unbind_cooling_device(struct thermal_zone_device *tz, 105 int trip, struct thermal_cooling_device *cdev); 106 107 This interface function unbind a thermal cooling device from the certain 108 trip point of a thermal zone device. This function is usually called in 109 the thermal zone device .unbind callback. 110 tz: the thermal zone device 111 cdev: thermal cooling device 112 trip: indicates which trip point the cooling devices is associated with 113 in this thermal zone. 114 1152. sysfs attributes structure 116 117RO read only value 118RW read/write value 119 120Thermal sysfs attributes will be represented under /sys/class/thermal. 121Hwmon sysfs I/F extension is also available under /sys/class/hwmon 122if hwmon is compiled in or built as a module. 123 124Thermal zone device sys I/F, created once it's registered: 125/sys/class/thermal/thermal_zone[0-*]: 126 |---type: Type of the thermal zone 127 |---temp: Current temperature 128 |---mode: Working mode of the thermal zone 129 |---trip_point_[0-*]_temp: Trip point temperature 130 |---trip_point_[0-*]_type: Trip point type 131 |---trip_point_[0-*]_hyst: Hysteresis value for this trip point 132 133Thermal cooling device sys I/F, created once it's registered: 134/sys/class/thermal/cooling_device[0-*]: 135 |---type: Type of the cooling device(processor/fan/...) 136 |---max_state: Maximum cooling state of the cooling device 137 |---cur_state: Current cooling state of the cooling device 138 139 140Then next two dynamic attributes are created/removed in pairs. They represent 141the relationship between a thermal zone and its associated cooling device. 142They are created/removed for each successful execution of 143thermal_zone_bind_cooling_device/thermal_zone_unbind_cooling_device. 144 145/sys/class/thermal/thermal_zone[0-*]: 146 |---cdev[0-*]: [0-*]th cooling device in current thermal zone 147 |---cdev[0-*]_trip_point: Trip point that cdev[0-*] is associated with 148 149Besides the thermal zone device sysfs I/F and cooling device sysfs I/F, 150the generic thermal driver also creates a hwmon sysfs I/F for each _type_ 151of thermal zone device. E.g. the generic thermal driver registers one hwmon 152class device and build the associated hwmon sysfs I/F for all the registered 153ACPI thermal zones. 154 155/sys/class/hwmon/hwmon[0-*]: 156 |---name: The type of the thermal zone devices 157 |---temp[1-*]_input: The current temperature of thermal zone [1-*] 158 |---temp[1-*]_critical: The critical trip point of thermal zone [1-*] 159 160Please read Documentation/hwmon/sysfs-interface for additional information. 161 162*************************** 163* Thermal zone attributes * 164*************************** 165 166type 167 Strings which represent the thermal zone type. 168 This is given by thermal zone driver as part of registration. 169 E.g: "acpitz" indicates it's an ACPI thermal device. 170 In order to keep it consistent with hwmon sys attribute; this should 171 be a short, lowercase string, not containing spaces nor dashes. 172 RO, Required 173 174temp 175 Current temperature as reported by thermal zone (sensor). 176 Unit: millidegree Celsius 177 RO, Required 178 179mode 180 One of the predefined values in [enabled, disabled]. 181 This file gives information about the algorithm that is currently 182 managing the thermal zone. It can be either default kernel based 183 algorithm or user space application. 184 enabled = enable Kernel Thermal management. 185 disabled = Preventing kernel thermal zone driver actions upon 186 trip points so that user application can take full 187 charge of the thermal management. 188 RW, Optional 189 190trip_point_[0-*]_temp 191 The temperature above which trip point will be fired. 192 Unit: millidegree Celsius 193 RO, Optional 194 195trip_point_[0-*]_type 196 Strings which indicate the type of the trip point. 197 E.g. it can be one of critical, hot, passive, active[0-*] for ACPI 198 thermal zone. 199 RO, Optional 200 201trip_point_[0-*]_hyst 202 The hysteresis value for a trip point, represented as an integer 203 Unit: Celsius 204 RW, Optional 205 206cdev[0-*] 207 Sysfs link to the thermal cooling device node where the sys I/F 208 for cooling device throttling control represents. 209 RO, Optional 210 211cdev[0-*]_trip_point 212 The trip point with which cdev[0-*] is associated in this thermal 213 zone; -1 means the cooling device is not associated with any trip 214 point. 215 RO, Optional 216 217passive 218 Attribute is only present for zones in which the passive cooling 219 policy is not supported by native thermal driver. Default is zero 220 and can be set to a temperature (in millidegrees) to enable a 221 passive trip point for the zone. Activation is done by polling with 222 an interval of 1 second. 223 Unit: millidegrees Celsius 224 Valid values: 0 (disabled) or greater than 1000 225 RW, Optional 226 227***************************** 228* Cooling device attributes * 229***************************** 230 231type 232 String which represents the type of device, e.g: 233 - for generic ACPI: should be "Fan", "Processor" or "LCD" 234 - for memory controller device on intel_menlow platform: 235 should be "Memory controller". 236 RO, Required 237 238max_state 239 The maximum permissible cooling state of this cooling device. 240 RO, Required 241 242cur_state 243 The current cooling state of this cooling device. 244 The value can any integer numbers between 0 and max_state: 245 - cur_state == 0 means no cooling 246 - cur_state == max_state means the maximum cooling. 247 RW, Required 248 2493. A simple implementation 250 251ACPI thermal zone may support multiple trip points like critical, hot, 252passive, active. If an ACPI thermal zone supports critical, passive, 253active[0] and active[1] at the same time, it may register itself as a 254thermal_zone_device (thermal_zone1) with 4 trip points in all. 255It has one processor and one fan, which are both registered as 256thermal_cooling_device. 257 258If the processor is listed in _PSL method, and the fan is listed in _AL0 259method, the sys I/F structure will be built like this: 260 261/sys/class/thermal: 262 263|thermal_zone1: 264 |---type: acpitz 265 |---temp: 37000 266 |---mode: enabled 267 |---trip_point_0_temp: 100000 268 |---trip_point_0_type: critical 269 |---trip_point_1_temp: 80000 270 |---trip_point_1_type: passive 271 |---trip_point_2_temp: 70000 272 |---trip_point_2_type: active0 273 |---trip_point_3_temp: 60000 274 |---trip_point_3_type: active1 275 |---cdev0: --->/sys/class/thermal/cooling_device0 276 |---cdev0_trip_point: 1 /* cdev0 can be used for passive */ 277 |---cdev1: --->/sys/class/thermal/cooling_device3 278 |---cdev1_trip_point: 2 /* cdev1 can be used for active[0]*/ 279 280|cooling_device0: 281 |---type: Processor 282 |---max_state: 8 283 |---cur_state: 0 284 285|cooling_device3: 286 |---type: Fan 287 |---max_state: 2 288 |---cur_state: 0 289 290/sys/class/hwmon: 291 292|hwmon0: 293 |---name: acpitz 294 |---temp1_input: 37000 295 |---temp1_crit: 100000 296 2974. Event Notification 298 299The framework includes a simple notification mechanism, in the form of a 300netlink event. Netlink socket initialization is done during the _init_ 301of the framework. Drivers which intend to use the notification mechanism 302just need to call thermal_generate_netlink_event() with two arguments viz 303(originator, event). Typically the originator will be an integer assigned 304to a thermal_zone_device when it registers itself with the framework. The 305event will be one of:{THERMAL_AUX0, THERMAL_AUX1, THERMAL_CRITICAL, 306THERMAL_DEV_FAULT}. Notification can be sent when the current temperature 307crosses any of the configured thresholds. 308

