1Generic Thermal Sysfs driver How To 2=================================== 3 4Written by Sujith Thomas <sujith.thomas@intel.com>, Zhang Rui <rui.zhang@intel.com> 5 6Updated: 2 January 2008 7 8Copyright (c) 2008 Intel Corporation 9 10 110. Introduction 12 13The generic thermal sysfs provides a set of interfaces for thermal zone 14devices (sensors) and thermal cooling devices (fan, processor...) to register 15with the thermal management solution and to be a part of it. 16 17This how-to focuses on enabling new thermal zone and cooling devices to 18participate in thermal management. 19This solution is platform independent and any type of thermal zone devices 20and cooling devices should be able to make use of the infrastructure. 21 22The main task of the thermal sysfs driver is to expose thermal zone attributes 23as well as cooling device attributes to the user space. 24An intelligent thermal management application can make decisions based on 25inputs from thermal zone attributes (the current temperature and trip point 26temperature) and throttle appropriate devices. 27 28[0-*] denotes any positive number starting from 0 29[1-*] denotes any positive number starting from 1 30 311. thermal sysfs driver interface functions 32 331.1 thermal zone device interface 341.1.1 struct thermal_zone_device *thermal_zone_device_register(char *name, 35 int trips, int mask, void *devdata, 36 struct thermal_zone_device_ops *ops) 37 38 This interface function adds a new thermal zone device (sensor) to 39 /sys/class/thermal folder as thermal_zone[0-*]. It tries to bind all the 40 thermal cooling devices registered at the same time. 41 42 name: the thermal zone name. 43 trips: the total number of trip points this thermal zone supports. 44 mask: Bit string: If 'n'th bit is set, then trip point 'n' is writeable. 45 devdata: device private data 46 ops: thermal zone device call-backs. 47 .bind: bind the thermal zone device with a thermal cooling device. 48 .unbind: unbind the thermal zone device with a thermal cooling device. 49 .get_temp: get the current temperature of the thermal zone. 50 .get_mode: get the current mode (enabled/disabled) of the thermal zone. 51 - "enabled" means the kernel thermal management is enabled. 52 - "disabled" will prevent kernel thermal driver action upon trip points 53 so that user applications can take charge of thermal management. 54 .set_mode: set the mode (enabled/disabled) of the thermal zone. 55 .get_trip_type: get the type of certain trip point. 56 .get_trip_temp: get the temperature above which the certain trip point 57 will be fired. 58 591.1.2 void thermal_zone_device_unregister(struct thermal_zone_device *tz) 60 61 This interface function removes the thermal zone device. 62 It deletes the corresponding entry form /sys/class/thermal folder and 63 unbind all the thermal cooling devices it uses. 64 651.2 thermal cooling device interface 661.2.1 struct thermal_cooling_device *thermal_cooling_device_register(char *name, 67 void *devdata, struct thermal_cooling_device_ops *) 68 69 This interface function adds a new thermal cooling device (fan/processor/...) 70 to /sys/class/thermal/ folder as cooling_device[0-*]. It tries to bind itself 71 to all the thermal zone devices register at the same time. 72 name: the cooling device name. 73 devdata: device private data. 74 ops: thermal cooling devices call-backs. 75 .get_max_state: get the Maximum throttle state of the cooling device. 76 .get_cur_state: get the Current throttle state of the cooling device. 77 .set_cur_state: set the Current throttle state of the cooling device. 78 791.2.2 void thermal_cooling_device_unregister(struct thermal_cooling_device *cdev) 80 81 This interface function remove the thermal cooling device. 82 It deletes the corresponding entry form /sys/class/thermal folder and 83 unbind itself from all the thermal zone devices using it. 84 851.3 interface for binding a thermal zone device with a thermal cooling device 861.3.1 int thermal_zone_bind_cooling_device(struct thermal_zone_device *tz, 87 int trip, struct thermal_cooling_device *cdev); 88 89 This interface function bind a thermal cooling device to the certain trip 90 point of a thermal zone device. 91 This function is usually called in the thermal zone device .bind callback. 92 tz: the thermal zone device 93 cdev: thermal cooling device 94 trip: indicates which trip point the cooling devices is associated with 95 in this thermal zone. 96 971.3.2 int thermal_zone_unbind_cooling_device(struct thermal_zone_device *tz, 98 int trip, struct thermal_cooling_device *cdev); 99 100 This interface function unbind a thermal cooling device from the certain 101 trip point of a thermal zone device. This function is usually called in 102 the thermal zone device .unbind callback. 103 tz: the thermal zone device 104 cdev: thermal cooling device 105 trip: indicates which trip point the cooling devices is associated with 106 in this thermal zone. 107 1082. sysfs attributes structure 109 110RO read only value 111RW read/write value 112 113Thermal sysfs attributes will be represented under /sys/class/thermal. 114Hwmon sysfs I/F extension is also available under /sys/class/hwmon 115if hwmon is compiled in or built as a module. 116 117Thermal zone device sys I/F, created once it's registered: 118/sys/class/thermal/thermal_zone[0-*]: 119 |---type: Type of the thermal zone 120 |---temp: Current temperature 121 |---mode: Working mode of the thermal zone 122 |---trip_point_[0-*]_temp: Trip point temperature 123 |---trip_point_[0-*]_type: Trip point type 124 |---trip_point_[0-*]_hyst: Hysteresis value for this trip point 125 126Thermal cooling device sys I/F, created once it's registered: 127/sys/class/thermal/cooling_device[0-*]: 128 |---type: Type of the cooling device(processor/fan/...) 129 |---max_state: Maximum cooling state of the cooling device 130 |---cur_state: Current cooling state of the cooling device 131 132 133Then next two dynamic attributes are created/removed in pairs. They represent 134the relationship between a thermal zone and its associated cooling device. 135They are created/removed for each successful execution of 136thermal_zone_bind_cooling_device/thermal_zone_unbind_cooling_device. 137 138/sys/class/thermal/thermal_zone[0-*]: 139 |---cdev[0-*]: [0-*]th cooling device in current thermal zone 140 |---cdev[0-*]_trip_point: Trip point that cdev[0-*] is associated with 141 142Besides the thermal zone device sysfs I/F and cooling device sysfs I/F, 143the generic thermal driver also creates a hwmon sysfs I/F for each _type_ 144of thermal zone device. E.g. the generic thermal driver registers one hwmon 145class device and build the associated hwmon sysfs I/F for all the registered 146ACPI thermal zones. 147 148/sys/class/hwmon/hwmon[0-*]: 149 |---name: The type of the thermal zone devices 150 |---temp[1-*]_input: The current temperature of thermal zone [1-*] 151 |---temp[1-*]_critical: The critical trip point of thermal zone [1-*] 152 153Please read Documentation/hwmon/sysfs-interface for additional information. 154 155*************************** 156* Thermal zone attributes * 157*************************** 158 159type 160 Strings which represent the thermal zone type. 161 This is given by thermal zone driver as part of registration. 162 E.g: "acpitz" indicates it's an ACPI thermal device. 163 In order to keep it consistent with hwmon sys attribute; this should 164 be a short, lowercase string, not containing spaces nor dashes. 165 RO, Required 166 167temp 168 Current temperature as reported by thermal zone (sensor). 169 Unit: millidegree Celsius 170 RO, Required 171 172mode 173 One of the predefined values in [enabled, disabled]. 174 This file gives information about the algorithm that is currently 175 managing the thermal zone. It can be either default kernel based 176 algorithm or user space application. 177 enabled = enable Kernel Thermal management. 178 disabled = Preventing kernel thermal zone driver actions upon 179 trip points so that user application can take full 180 charge of the thermal management. 181 RW, Optional 182 183trip_point_[0-*]_temp 184 The temperature above which trip point will be fired. 185 Unit: millidegree Celsius 186 RO, Optional 187 188trip_point_[0-*]_type 189 Strings which indicate the type of the trip point. 190 E.g. it can be one of critical, hot, passive, active[0-*] for ACPI 191 thermal zone. 192 RO, Optional 193 194trip_point_[0-*]_hyst 195 The hysteresis value for a trip point, represented as an integer 196 Unit: Celsius 197 RW, Optional 198 199cdev[0-*] 200 Sysfs link to the thermal cooling device node where the sys I/F 201 for cooling device throttling control represents. 202 RO, Optional 203 204cdev[0-*]_trip_point 205 The trip point with which cdev[0-*] is associated in this thermal 206 zone; -1 means the cooling device is not associated with any trip 207 point. 208 RO, Optional 209 210passive 211 Attribute is only present for zones in which the passive cooling 212 policy is not supported by native thermal driver. Default is zero 213 and can be set to a temperature (in millidegrees) to enable a 214 passive trip point for the zone. Activation is done by polling with 215 an interval of 1 second. 216 Unit: millidegrees Celsius 217 Valid values: 0 (disabled) or greater than 1000 218 RW, Optional 219 220***************************** 221* Cooling device attributes * 222***************************** 223 224type 225 String which represents the type of device, e.g: 226 - for generic ACPI: should be "Fan", "Processor" or "LCD" 227 - for memory controller device on intel_menlow platform: 228 should be "Memory controller". 229 RO, Required 230 231max_state 232 The maximum permissible cooling state of this cooling device. 233 RO, Required 234 235cur_state 236 The current cooling state of this cooling device. 237 The value can any integer numbers between 0 and max_state: 238 - cur_state == 0 means no cooling 239 - cur_state == max_state means the maximum cooling. 240 RW, Required 241 2423. A simple implementation 243 244ACPI thermal zone may support multiple trip points like critical, hot, 245passive, active. If an ACPI thermal zone supports critical, passive, 246active[0] and active[1] at the same time, it may register itself as a 247thermal_zone_device (thermal_zone1) with 4 trip points in all. 248It has one processor and one fan, which are both registered as 249thermal_cooling_device. 250 251If the processor is listed in _PSL method, and the fan is listed in _AL0 252method, the sys I/F structure will be built like this: 253 254/sys/class/thermal: 255 256|thermal_zone1: 257 |---type: acpitz 258 |---temp: 37000 259 |---mode: enabled 260 |---trip_point_0_temp: 100000 261 |---trip_point_0_type: critical 262 |---trip_point_1_temp: 80000 263 |---trip_point_1_type: passive 264 |---trip_point_2_temp: 70000 265 |---trip_point_2_type: active0 266 |---trip_point_3_temp: 60000 267 |---trip_point_3_type: active1 268 |---cdev0: --->/sys/class/thermal/cooling_device0 269 |---cdev0_trip_point: 1 /* cdev0 can be used for passive */ 270 |---cdev1: --->/sys/class/thermal/cooling_device3 271 |---cdev1_trip_point: 2 /* cdev1 can be used for active[0]*/ 272 273|cooling_device0: 274 |---type: Processor 275 |---max_state: 8 276 |---cur_state: 0 277 278|cooling_device3: 279 |---type: Fan 280 |---max_state: 2 281 |---cur_state: 0 282 283/sys/class/hwmon: 284 285|hwmon0: 286 |---name: acpitz 287 |---temp1_input: 37000 288 |---temp1_crit: 100000 289 2904. Event Notification 291 292The framework includes a simple notification mechanism, in the form of a 293netlink event. Netlink socket initialization is done during the _init_ 294of the framework. Drivers which intend to use the notification mechanism 295just need to call thermal_generate_netlink_event() with two arguments viz 296(originator, event). Typically the originator will be an integer assigned 297to a thermal_zone_device when it registers itself with the framework. The 298event will be one of:{THERMAL_AUX0, THERMAL_AUX1, THERMAL_CRITICAL, 299THERMAL_DEV_FAULT}. Notification can be sent when the current temperature 300crosses any of the configured thresholds. 301

